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WEP 858D (110V) Hot Air Rework Soldering Station, Suitable For SMD, SOIC, CHIP, QFP, PLCC, BGA

WEP 858D (110V) Hot Air Rework Soldering Station, Suitable For SMD, SOIC, CHIP, QFP, PLCC, BGA Details :

• High Efficient, Space Saving and Extremely Low Noise, Enhanced Temperature Stability
• Comfortable Portable Handheld Hot Air Gun,Build-in Microcomputer Control, Warning-Up Quickly
• Digital L.E.D Screen for Hot Air Gun Precision Temperature Displays
• Alloy Metal Body with High Quality Silicone Shell for Extended Life and Power Saving
• Attention: Works under 110V Voltage, comes with 3 types of nozzles

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